The Ministry of Industry and Information Technology has approved the establishment of the National Integrated Circuit Characteristic Process and Packaging Test Innovation Center in Jiangsu.
This is the second national manufacturing innovation center established in Jiangsu after the National Advanced Functional Fiber Innovation Center. It is also the 16th national manufacturing innovation center in China. Jiangsu Huajin Semiconductor Packaging Research Center Co., Ltd. is responsible for the establishment of the National Integrated Circuit Characteristic Process and Packaging Test Innovation Center. The center will gather upstream and downstream resources in the industry chain, build an innovation system with enterprises as the mainstay and a combination of production, education and research in the hope of breaking through the key common technologies of integrated circuit characteristics and packaging and testing so as to build an industry common technology research and development platform and talent training base, and promote the innovative development of China's integrated circuit industry.
