Major investment projects have been pressed ahead in smooth progress in Xuzhou and Nantong since the beginning of this year.
Located in the core area of Jinlong Lake in Xuzhou City, Jinlong Lake Innovation Valley is a high-end specialized industrial park and provincial-level major project supported by Xuzhou. In the next six months, the heavyweight giants of the semiconductor industry such as Jiangsu Tiantuo Semiconductor Integrated Circuit Technology Park and the Institute of Microelectronics of the Chinese Academy of Sciences will be settled here.
Jinlong Lake Innovation Valley covers an area of 84.7 acres and a building area of 89,000 square meters. At present, the main building of the first phase of the project has been completed and is expected to be put into use on May 1 next year.
Upon its completion, Jinlonghu Innovation Valley will focus on the innovation and transformation of semiconductor special equipment, key components and auxiliary equipment, chips and devices, and pilot technology, in particular the development of integrated circuit equipment, photo-resist materials, smart wearable devices and other application terminal.
In Nantong, the second phase of the Tongfu Microelectronics intelligent chip packaging and testing project, with a total investment of 8 billion yuan, is planned to be put into use in the first half of the year. The company has simultaneously planned the development of the production line and the world's most advanced fan-out packaging production line has completed the pilot line erection and begun to produce samples.
After the implementation of the second phase of the project, the enterprise will start the third phase construction in due course. The Nantong Tongfu project will form a production capacity of 3.6 billion pieces of packaging and testing integrated circuits and 1.32 million pieces of wafer testing, making it the world's leading advanced packaging and testing base.
(Source：ourjiangsu.com)
